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All-Con to exhibit conveying system

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Posted On: 09/20/2006

All-Con World Systems, Inc. will exhibit its Hot-Melt Glue Chip Conveying System at 2006 Pack Expo/Process Expo. Designed for production-line packaging applications, this automated, stand-alone system conveys a consistent flow of thermoplastic adhesives to hot-melt glue melters.

It can transport solid hot-melt glue, either pellets (B-Bs) or chiclet-sized chips, a distance of more than 100-ft from a bulk source to a melter unit. And, it feeds either a single or multiple glue stations — all receiving material from the same container of adhesives.

The proprietary system is time tested, and proven to be highly efficient and dependable.  Its performance record is second-to-none, especially for multi-station system applications. It has improved customers’ material handling efficiency, lowered their maintenance costs and reduced down time.

All-Con World Systems, Inc.
P.O. Box 647
Seaford, DE 19973
Tel: 302-628-3380; Fax: 302-628-3390
e-mail:sales@all-con.com
www.all-con.com

Key Personnel

• G. Barry Slater, President
• Mark C. Allen, Sales Engineer
• Ron Ullman, Project Manager
• Tim Gavigan, Project Engineer