All-Con to exhibit conveying system
Posted On: 09/20/2006
All-Con World Systems, Inc. will exhibit its Hot-Melt Glue Chip Conveying System at 2006 Pack Expo/Process Expo. Designed for production-line packaging applications, this automated, stand-alone system conveys a consistent flow of thermoplastic adhesives to hot-melt glue melters.
It can transport solid hot-melt glue, either pellets (B-Bs) or chiclet-sized chips, a distance of more than 100-ft from a bulk source to a melter unit. And, it feeds either a single or multiple glue stations — all receiving material from the same container of adhesives.
The proprietary system is time tested, and proven to be highly efficient and dependable. Its performance record is second-to-none, especially for multi-station system applications. It has improved customers’ material handling efficiency, lowered their maintenance costs and reduced down time.
- G. Barry Slater, President
- Mark C. Allen, Sales Engineer
- Ron Ullman, Project Manager
- Tim Gavigan, Project Engineer
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